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Complete
Range Of Epoxy Products
- Epoxy
Molding Compound
Encapsulation of a full range of semiconductor IC
packages.
- Epoxy
Die Attach Paste
Attaching semiconductor IC chips onto leadframes
- Epoxy
Liquid & Resin
High purity Glob-top material for COB (Chip On Board)
and TAB (Tab Automated Bonding) applications, High
purity underfill material for flip chips, High purity
chip coating material for tape carrier packages, etc.
- ACP
& NCP
ACP (Anisotropic Conductive Paste) and NCP (Non-conductive
Paste) for flip chip on FPC (Flexible Printed Circuit),
rigid printed circuit board and glass epoxy board
applications.
- Epoxy
Coating Powder
Overcoating of hybrid ICs, thermistors, varistors,
resistor networks and film capacitors, etc
- Epoxy
Potting Liquid
Potting for fly-back transformers, ignition coils,
power modules, diodes, IC regulators and solid-state
relays, etc.
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- Liquid
Adhesives
Full range of different polymeric-based liquid adhesives including
epoxy, cyanoacrylate, silicone rubber, polyester, acrylic,
polysulfide, polyurethane, butyl rubber, chloroprene rubber,
nitrile rubber, SBR, etc.
Various curing methods are available including heat curing,
room temperature curing, instantaneous curing, UV curing.
Bonding a wide range of substrate materials including metal,
rubber, plastics, heat insulation materials for electrical
and electronic industries.
- Hot
Melt Adhesives
Include polyester, EVA, polyamide, styrene block copolymer
rubber.
- Adhesive
Tapes
Single face, double-face and non support type of adhesive
tapes in various forms including the double-face adhesive
tapes for lamination of PET, PC, PP, felt, PU-foam, paper,
etc; protective and masking tapes, high temperature purpose
polyimide tape to withstand solder-bath temperature (280°C);
hot-melt heat press type; UV de-activated carrier tapes; conductive
tapes --- carbon-filled, nickel-filled and gold-filled anisotropic
tapes.
- Others
Diluents, solvents, primers, etc.
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Enquiries
Vandashima (Singapore) Pte Ltd - Established in 1983
www.vandashima.com
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